Surgery; Dental-oral, Maxillo-facial Surgery
Objectives: The aim of this study is to compare the depth of cure of two composite materials (SDR and Filtek bulk-fill) cured at variable increment depths (2, 4, and 6 mm) and voltages (180 and 220 volts).
Materials and Methods: Each sample of the composite material was packed in a mold of 2 mm, 4 mm, and 6 mm and curing light (quartz tungsten halogen) of optimal intensity was exposed for 20 s at 2 different voltages on each specimen. After curing, the specimens were removed and the composite on the nonexposed end was scraped with a plastic instrument. The remaining composite thickness was measured using a digital Vernier caliper. The reading was divided by half to follow the ISO 4049 method. Independent sample t-test, one-way ANOVA, and linear regression analysis were applied. Level of significance was kept at 0.01.
Results: The mean DOC of SDR and Filtek were 1.93 ± 0.82 and 1.77 ± 0.65 mm. Lowering the voltage from 220 to 180 volts reduced the depth of Filtek from 1.87 ± 0.74 to 1.67 ± 0.54 mm, whereas the DOC of SDR remained unchanged at 1.93 mm at the two voltages. The adjusted R2 for the depth of cure was 0.93 when the increment thickness, voltage, and restorative material were taken together in the regression model.
Conclusions: There was no statistically significant difference between SDR and Filtek for the depth of cure at 2 and 4 mm increments. However, at 6 mm increment, the SDR cured significantly deeper than the Filtek. Around 91% variation in the depth of cure of these composites materials is explained by increment thickness alone.
Contemporary Clinical Dentistry
Hameed, M. H.,
Khan, F. R.
(2019). Comparison of the depth of cure of flowable composites polymerized at variable increment thicknesses and voltages: An In vitro study. Contemporary Clinical Dentistry, 10(2), 220-225.
Available at: https://ecommons.aku.edu/pakistan_fhs_mc_surg_dent_oral_maxillofac/144
Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial-Share Alike 4.0 International License.